In the laminated circuit board device 10 illustrated in FIGS. 1 to 3C, it is possible to prevent the noise waveform Wn from being superimposed on the signal system wiring pattern P2s on the second layer 10b located at the middle position of the first layer 10a and the third layer 10c due to the influence of the induction magnetic field from the electric power system wiring patterns P1p, P3p adjacent to the signal system wiring pattern P2s. In addition, since it is not necessary to prepare a layer of the ground pattern in order to shield noise from the power line, both the first layer 10a and the third layer 10c can be used for pattern disposition of the power lines. Therefore, even when the area occupied by the pattern of the power line is reduced, the resistance of the power line can be reduced by the use of the plurality of layers, and the power loss can be reduced. Therefore, it is easy to reduce the size of the laminated circuit board device 10.

In addition, the shapes of the electric power system wiring patterns P1p, P3p do not necessarily coincide with each other except for the portion facing the signal system wiring pattern P2s to be protected, and patterns of various shapes can be formed, for example, as illustrated in FIGS. 4A and 4B. By defining the shape such that the sum (LA1+LB1+LC1) of the pattern widths in the first layer 10a and the sum (LA3+LB3+LC3) of the pattern widths in the third layer 10c coincide with each other, the noise waveform Wn can be effectively reduced.