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Laminated circuit board device

專利號(hào)
US11564308B2
公開日期
2023-01-24
申請(qǐng)人
Yazaki Corporation(JP Tokyo)
發(fā)明人
Tsunehiro Watanabe
IPC分類
H05K1/02
技術(shù)領(lǐng)域
pattern,wiring,layer,p1p,i2b,i2a,circuit,power,in,induction
地域: Tokyo

摘要

A circuit pattern of a power line and a circuit pattern of a signal line are disposed in a first layer of a laminated circuit board device, a circuit pattern of the signal line to be protected is disposed in a second layer, and a circuit pattern of a power line is disposed in a third layer. The shapes of the first circuit pattern of the power line of the first layer and the second circuit pattern of the power line of the third layer are substantially matched with each other with respect to a portion of the second layer facing the circuit pattern of the signal line. The direction of the current of the first circuit pattern coincides with the direction of the current of the second circuit pattern.

說明書

According to the laminated circuit board device having the above configuration, a vacant space can be formed between the branching portions and the merging portions between the first circuit pattern and the second circuit pattern. Therefore, another circuit can be disposed in the vacant space, or the electronic component can be disposed. In addition, since the sum of the pattern widths is the same in the first circuit pattern and the second circuit pattern, the distribution of the current flowing in the first circuit pattern and the distribution of the current flowing in the second circuit pattern can be easily aligned. That is, the induction magnetic field generated by the current change of the first circuit pattern and the induction magnetic field generated by the current change of the second circuit pattern can be aligned.

One end of the first circuit pattern and one end of the second circuit pattern are configured to be connectable to a common power source (21) or a common load via a common circuit (via 13) one end side, and the other end of the first circuit pattern and the other end of the second circuit pattern may be configured to be connectable to a common load (24) or a common power source via a common circuit (via 14) on the other end side.

According to the laminated circuit board device having the above configuration, one end of the first circuit pattern and one end of the second circuit pattern can be connected to a common power source or a common load by the one end side common circuit. Further, the other end of the first circuit pattern and the other end of the second circuit pattern can be connected to a common load or a common power source by the other end side common circuit. Therefore, it is easy to supply a common current to the first circuit pattern and the second circuit pattern.

權(quán)利要求

1
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