Circuit module
地域：
Tokyo
摘要
A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.
說明書
This is a Continuation of application Ser. No. 16/284,231 filed Feb. 25, 2019, which claims the benefit of Japanese Patent Application No. 2018-033425 filed Feb. 27, 2018. The disclosure of the prior applications is hereby incorporated by reference herein in its entirety.
The present invention relates to a circuit module.
There is known a circuit module equipped with a wiring structure, an electronic component arranged on the upper surface of the wiring structure, and an insulating resin layer in which the electronic component is embedded. As is known, a metal layer is provided on the upper surface of the insulating resin layer for electromagnetic shielding of the electronic component.
- [Patent Document 1] Japanese Unexamined Patent Publication No. 2010-114291
權(quán)利要求
What is claimed is:1. A circuit module comprising:a wiring structure; at least one electronic component arranged on an upper surface of the wiring structure; an insulating resin layer provided on the upper surface of the wiring structure and in which the at least one electronic component is embedded; and a metal layer provided on an upper surface of the insulating resin layer, wherein when a surface roughness of a portion directly above the at least one electronic component on the upper surface of the insulating resin layer is expressed as R1, and a surface roughness of a portion other than the portion directly above the at least one electronic component on the upper surface of the insulating resin layer is expressed as R2, at least one R1 satisfies the condition: R1>R2, when a surface roughness of a portion directly above the at least one electronic component on an upper surface of the metal layer is expressed as R3, at least one R1 and R3 satisfy the condition: R1>R3, and at least a part of an upper surface of the at least one electronic component has a concave or a convex configuration, and the upper surface of the insulating resin layer above the at least one electronic component and the upper surface of the at least one electronic component has a same shape. 2. The circuit module according to claim 1 , wherein R1/R2 ranges from 1.01 to 8.00. 3. The circuit module according to claim 1 , wherein the portion directly above the at least one electronic component on the upper surface of the metal layer is flat.
意見反饋
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