In the following, preferred embodiments of the present invention will be described in detail. In the drawings, the same or equivalent components are designated by the same reference numerals. The upper limit value and the lower limit value of each value range given in the present specification allow arbitrary combination.

A circuit module 2 according to the present embodiment will be described with reference to FIG. 1. The circuit module 2 is equipped with a wiring structure 4, electronic components 6a and 6b, connection portions 20 and 22, an insulating resin layer 8, and a metal layer 10.

The wiring structure 4 has an insulating layer 24, and a plurality of wiring layers 12 and 14 provided on the upper surface of the insulating layer 24. The material of the insulating layer 24 may, for example, be resin, ceramic, or resin-impregnated glass fiber. The resin may be epoxy resin, polyimide or the like. The ceramic may be alumina or the like. The ceramic may be LTCC (low temperature co-fired ceramics), HTCC (high temperature co-fired ceramics) or the like. The resin-impregnated glass fiber may be CCL (copper clad laminate) or the like. The material of the wiring layers 12 and 14 may be copper (Cu), nickel (Ni) or the like.