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Radio frequency (RF) system with RF isolation chambers and method of manufacture

專利號(hào)
US11612051B1
公開日期
2023-03-21
申請(qǐng)人
LOCKHEED MARTIN CORPORATION(US MD Bethesda)
發(fā)明人
Andrew E. White; James J. LaFrance; Thomas J. Clark; Richard K. Andrews
IPC分類
H05K1/02; H05K3/42; H01L23/66
技術(shù)領(lǐng)域
fence,pwb,circuit,may,rf,wall,walls,via,vias,or
地域: MD MD Bethesda

摘要

A system includes a printed circuit board (PCB). The PCB includes a radio frequency (RF) circuit that includes a plurality of circuit modules and signal trace lines. Each circuit module is electrically connected to at least one other circuit module by a signal trace line. The system includes a via fence comprising fence walls having at least two materials laminated using a printed wire board (PWB) process. The fence walls include a plurality of vias. The fence walls form a plurality of free-form RF isolation chambers, each chamber includes chamber walls that surround each circuit module outside of the PCB. The embodiments also include a method of manufacturing and/or isolating the system or components of the system.

說明書

The fence pattern 141 may include an interior-common via fence wall, which is shared by and between adjacent fence chambers. The interior-common via fence wall may have a longitudinal dimension which is generally aligned with the longitudinal dimension of the perimeter fence walls 141A and 141B, but may intersect with shared interior-fence wall 208. In FIG. 2B, via chamber 142I shares a portion of an interior common wall 202 of via fence chamber 142G and a portion of an interior common wall of via fence chamber 142H. The process allows for variation in size and placement of plated thru via holes by altering the drilling pattern of the vias. This allows for tailored isolation where needed for the specific design/frequencies by optimizing the size and location of the individual vias in the wall structure 144.

The plurality of circuit modules 120 have a circuit layout that provides some circuit modules that are generally side-by-side along a first dimension and others circuit modules are generally side-by-side along a second dimension that is perpendicular to the first dimension.

FIG. 3 illustrates a top view of a cover 150 installed on the via fence 140 of a front-end RF stage 104″.

權(quán)利要求

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