FIG. 6 illustrates a cross-sectional view of a radio frequency device of FIG. 5 with circuit modules shown in phantom to show the signal trace lines 625A and 625B passing through a pass through the fence wall 543. The second PCB material 514 forms an encapsulating layer surrounding the inner wall of first PCB material 512. The bottom surface of the fence wall eliminates portions of the second PCB material so that those portions are non-conductive by the absence of the conductive second PCB material 514. Furthermore, the solder or epoxy 515 is also absent at those portions so that the signal trace lines provide a conductive electrical path between chambers. Alternately or in addition to, in some embodiments, portions of the conductive material 514 does not require to be removed. For example, the wall provides an opening for the signal trace, the signals can also be connected thru other inner (lower) layers of the PWB making the cavities completely closed.

FIG. 7 illustrates a method 700 for designing a circuit of a front-end RF stage 104 with an independent via fence 140. The method steps may be performed in the order shown or a different order. One or more of the steps may be performed contemporaneously. One or more of the method steps may be omitted and steps may be added. The method steps may be performed using hardware, software, firmware or a combination thereof.