As defined herein the term printed wire board (PWB) refers to the circuit board without electronic components. The term printed circuit board (PCB) includes the circuit board or PWB with electronic components. PWB may also refer to a circuit card assembly (CCA). Typically, PWB s are constructed of material cores (metal/dielectric/metal) that may be laminated together. For example, lamination processes may use pregs (a dielectric glue to hold the cores together to form a core stackup). The processes for creating and laminating material cores together are known to individuals with ordinary skill in the art of PWB manufacture. A PWB stack may include National Electrical Manufacturers Association (NEMA) class FR4 materials for a core substrate. FR4 is generally known as a glass-reinforced epoxy laminate material. Nonetheless, the embodiments herein are not limited to FR4 material, but other dielectric materials. The core substrate of a PWB may use composite epoxy material (CEM), such as CEM-3, which includes woven glass fabric surfaces. CEM-3 may include a non-woven glass core combined with an epoxy synthetic resin. The PWB may use other materials such as, without limitation, ceramics, phenol-based resin, Polytetrafluoroethylene (PTFE) such as Teflon?, or fiberglass. The PCB may be made of materials suitable for a high-frequency environment such as frequencies in range which exceed 1 GHz, for example.

The PWB stack may include metallization layers made of copper (Cu). In some embodiments, the PCB may include a ground layer, made of gold (Au), silver (Ag), aluminum (Al) or copper (Cu), for example.