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Electronic device including metal housing

專利號(hào)
US11612066B2
公開(kāi)日期
2023-03-21
申請(qǐng)人
Samsung Electronics Co., Ltd.(KR Suwon-si)
發(fā)明人
Junghyun Im; Hyosang Lim; Heekwang Lim; Seungchang Baek; Hyeongsam Son; Sungho Cho; Hangyu Hwang; Jongchul Choi
IPC分類
H05K5/02; H05K5/00
技術(shù)領(lǐng)域
metal,part,may,polymer,adhesive,first,second,plate,in,member
地域: Suwon-si

摘要

An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible through the front plate. The frame surrounds an interior space between the front plate and the back plate and formed of a metallic material. The frame includes a first metal part and a second metal part. The polymer member is coupled to the frame and contains a polymer material. The adhesive layer bonds the polymer member and the frame. The frame includes an opening formed in a first part thereof. The opening is formed through the first metal part and being formed to a specified depth through the second metal part. The polymer member forms at least part of an inner surface of the opening.

說(shuō)明書(shū)

Referring to FIG. 10, the method 1000 for manufacturing the side member (e.g., the side member 200 of FIG. 4) may include an operation 1010 of forming an outer metal part (e.g., the first metal part 210 of FIGS. 8A and 8B), an operation 1020 of coupling an inner metal part (e.g., the second metal part 220 of FIGS. 8A and 8B) and the outer metal part, an operation 1030 of forming a recess (e.g., the recess 240 of FIGS. 7A and 8B) on contact surfaces (e.g., the first coupling area 271 of FIGS. 8A and 8B), an operation 1040 of forming adhesive layers (e.g., the adhesive layer 260 of FIGS. 7A and 8B) on the outer metal part and the inner metal part, an operation 1050 of forming a polymer part (e.g., the second portion 232 of FIGS. 8A and 8B), and an operation 1050 of machining the side member.

In an embodiment, the operation 1010 of forming the outer metal part may include an operation of bending rod-shaped metal base materials (e.g., first metal base materials 1111 of FIGS. 11A-11E).

權(quán)利要求

1
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