Electronic device including metal housing
摘要
說明書
In various embodiments, the adhesive layer 260 may include an organic adhesive layer containing an organic material.
In various embodiments, the adhesive layer 260 may include a first adhesive layer 261 coupled with the first metal part 210 and a second adhesive layer 262 coupled with the second metal part 220, the first adhesive layer 261 may contain the first metallic material, the polymer material, and the organic material, and the second adhesive layer 262 may contain the second metallic material, the polymer material, and the organic material.
In various embodiments, the opening 250 may extend along a lengthwise direction of the frame structure 201. When viewed in an extension direction of the opening 250, the polymer part 230 may include a first portion 232-1 adjacent to a first end portion of the opening 250 in the extension direction and a second portion 232-2 adjacent to a second end portion of the opening 250 in the extension direction. Each of the first portion 232-1 and the second portion 232-2 may form a portion of the inner surface of the opening 250.
In various embodiments, the polymer part 230 may further include a third portion 232-3 extending from the first portion 232-1 to the second portion 232-2 along the inner surface of the opening 250.
In various embodiments, the opening 250 may be formed through at least part of the polymer part 230.
