An electronic device 100 according to embodiments of the disclosure may include a housing 110 including a front plate such as the first plate 120, a back plate 180 that faces away from the front plate such as the first plate 120, and a side member 200 that surrounds an interior space between the front plate such as the first plate 120 and the back plate 180. A first part of the side member 200 may include a first metal part 210 that forms a surface of the electronic device and that contains a first metallic material, a second metal part 220 that is coupled to the first metal part 210 so as to extend in a direction from the first metal part 210 toward the interior space and that contains a second metallic material, a polymer part 230 that is coupled to the first metal part 210 and the second metal part 220 and that contains a polymer material, and a first adhesive layer 261 that bonds the polymer part 230 and the first metal part 210. A recess 240 may be concavely formed on the first metal part 210 and the second metal part 220 in a direction toward the front plate such as the first plate 120 or the back plate 180, and the polymer part 230 may include a first portion 231 that forms an outer surface of the side member 200 and that is formed on an area around the recess 240 and a second portion 232 that extends from the first portion 231 into the recess 240.

In various embodiments, the first adhesive layer 261 may extend from the area around the recess 240 to an inner surface of the recess 240.