Welding quality processing method and device, and circuit board
摘要
說明書
After the welding temperature change curve is obtained, it is also necessary to obtain the warpage data corresponding to the temperature change curve of each circuit board layer in the multi-layer circuit board. That is, when the multi-layer circuit board is subjected to the corresponding temperature change during the welding process, the warpage data of each region of each circuit board layer at each time point is obtained. It is understood that the warpage data may be obtained by non-contact measurement technology. By simulating and physically building a reflow welding process and operating environmental conditions, a complete historical warpage displacement performance is captured to obtain more realistic warpage data. It is also possible to input specific parameters of the corresponding circuit board and set specific environmental conditions to obtain the warpage data through simulation.
