After obtaining the warpage level, the multi-layer circuit board is processed according to the warpage level. For example, a prompt is made for a corresponding region to promote the designer to adjust the parameters. Furthermore, it is also possible to analyze the cause of the warpage level according to the stacked state of the multi-layer circuit board or the obtained welding simulation parameters. For example, possible causes of the warpage may be summarized by machine learning based on historical data to promote the designer to make adjustments. Furthermore, it is also possible to automatically calculate the design parameters. For example, if a residual copper rate in the current region is above 5%, it needs to be adjusted to below 3% to meet the standard. It is understood that the design parameters also include a relative position of the multi-layer circuit board, a material of the multilayer circuit board, and a welding position of a component of the multi-layer circuit board, which are not specifically limited therein.

At the same time, since the simulation can be made for each stage in the temperature curve to obtain the warpage state and judge the warpage level for each temperature state, the entire welding process may be dynamically analyzed according to embodiments of the present disclosure, and the risks in the welding process may be comprehensively grasped.

Through the method according to embodiments of the present disclosure, the warpage level of the circuit board during the welding process may be obtained before the actual welding, and the warpage risk may be judged, such that the warpage risk may be dynamically analyzed, and the circuit board may be processed based on the warpage level to guarantee the welding quality of the circuit board.