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Welding quality processing method and device, and circuit board

專利號(hào)
US11617258B2
公開(kāi)日期
2023-03-28
申請(qǐng)人
BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.(CN Beijing)
發(fā)明人
Zhenya Kang; Jinbao Guo
IPC分類
B23K31/00; H05K1/02; G06F30/20; B23K1/00; B23K3/08; H05K3/34; B23K31/12; B23K101/42; G06F115/12
技術(shù)領(lǐng)域
warpage,board,welding,circuit,layer,multi,simulation,in,risk,data
地域: Beijing

摘要

A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.

說(shuō)明書(shū)

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

FIG. 1 is a flow chart illustrating a welding quality processing method according to some embodiments of the present disclosure.

FIG. 2 is a graph illustrating a welding temperature change curve according to some embodiments of the present disclosure.

FIG. 3 is a schematic diagram illustrating a stake state of a circuit board according to some embodiments of the present disclosure.

FIG. 4 is a schematic diagram illustrating a software running state of a welding quality processing method according to some embodiments of the present disclosure.

FIG. 5 is a schematic diagram illustrating a welding quality processing device according to some embodiments of the present disclosure.

DETAILED DESCRIPTION

權(quán)利要求

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