As can be seen by comparing FIGS. 3 and 4, the wiring 43 shown in FIG. 3 overlaps the signal wiring 42s2. FIG. 5 is an enlarged cross-sectional view taken along an extension direction of the signal terminal 45s1 shown in FIG. 3. However, the cross section taken along the extension direction of the signal terminal 45s2 shown in FIG. 3 also has a structure similar to that of FIG. 5. Therefore, the signal terminals 44s1 and 45s1 shown in FIG. 5 can be replaced with the signal terminals 44s2 and 45s2. In addition, the signal wiring 42s1 shown in FIG. 5 can be replaced with the signal wiring 42s2. As shown in FIG. 6, the plurality of terminals 45 include the signal terminal 45s2 electrically connected to the signal terminal 44s2. The width 44s2W of the signal terminal 44s2 shown in FIG. 4 is larger than the width 45s2W of the signal terminal 45s2 shown in FIG. 3. As shown in FIG. 6, a separation distance 44GP2 between the signal terminal 44s1 and the signal terminal 44s2 is smaller than the separation distance 45GP2 between the signal terminal 45s1 and the signal terminal 45s2. In an opening OP3 (see FIG. 4) formed in the solder resist film SR1, the signal terminal 44s2 is electrically connected to the substrate PCB1 via a conductive joint material SB3 electrically separated from the conductive joint materials SB1 and SB2.