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Rack assembly for vertical airflow cooled devices

專利號
US11659692B2
公開日期
2023-05-23
申請人
Microsoft Technology Licensing, LLC(US WA Redmond)
發(fā)明人
Peter Alfred Devick Peterson; Nilofer Rajpurkar; John Reed Hannig; Patrick Gerard Brogan; Scott Allen Densmore; Kenneth S. Hayd
IPC分類
H05K7/20; G06F1/20
技術(shù)領(lǐng)域
assembly,airflow,computers,sub,air,plane,in,fan,fans,control
地域: WA WA Redmond

摘要

An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.

說明書

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

The airflow through the computers picks up heat generated by operation of the computers and is confined by the top 940. The airflow then proceeds to exit the top sub-assembly as indicated by arrow 965. The exiting of the airflow may be added by a fan or array of fans (not shown in FIG. 9). Airflow through the computers 910 may also be assisted via a fan or fans within the computers 910.

EXAMPLES

1. An assembly includes a lower sub-assembly containing a first fan a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths, and a top sub-assembly supported above the middle sub-assembly.
2. The assembly of example 1 and further comprising a second fan disposed above the top air flow control plane to act in cooperation with the first fan to move air through the vertical cooling air paths of the multiple computers.
3. The assembly of example 2 wherein the top sub-assembly comprises a double walled top and forms a plenum to facilitate air flow through the second fan.
4. The assembly of any of examples 1-3 and further comprising middle rails to moveably support the middle sub-assembly.
5. The assembly of example 4 and further comprising bottom rails to movably support the bottom sub-assembly.
6. The assembly of any of examples 1-5 wherein the computers are cylindrical in shape and wherein the airflow control planes contain round openings corresponding to the cylindrical shape of the computers.

權(quán)利要求

1
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