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Display panel having an encapsulation layer comprises plurality of protrusions and manufacturing method having the same thereof

專利號(hào)
US11659730B2
公開日期
2023-05-23
申請(qǐng)人
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.（CN Hubei）
發(fā)明人
Chao He
IPC分類
H01L29/08
技術(shù)領(lǐng)域
layer,display,inorganic,panel,ink,light,organic,layers,disclosure,resin
地域： Hubei

摘要

The disclosure provides a display panel and a manufacturing method thereof. The display panel includes a substrate, a luminescent layer, and an encapsulation layer. The encapsulation layer includes a plurality of protrusions or a plurality of recesses. The protrusions or the recesses are formed on a side of the encapsulation layer away from the substrate. Because the protrusions are formed from cured ink, a manufacturing process is simple and costs are reduced. Furthermore, the protrusions may increase a ratio of light usage of the display panel and improve display quality of the display panel.

說明書

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
FIELD

The present disclosure relates to the field of display technologies, and more particularly, relates to a display panel and a manufacturing method thereof.

BACKGROUND

Organic light-emitting diode (OLED) display devices have been widely used in various fields due to advantages such as thin body, self-luminescence, wide viewing angles, lower power consumption, and eco-friendly properties.

OLED display panels consist of multiple layers including a glass substrate, a plurality of functional layers, etc. Different layers have different light transmittance, wherein some layers have good light transmittance, while some layers have poor light transmittance. When light is transmitted in such layers, about 80% of the light cannot be emitted into air because of reflection and refraction, thereby reducing light transmittance of the OLED display panels, and affecting display quality. To improve luminous efficiency of the OLED display devices, an electrode structure of the OLED display devices is changed by conventional technologies. For example, adding a light extraction layer into the OLED display devices, or etching a surface of a substrate to form some microstructures. However, the above designs can only slightly increase light extraction efficiency of the OLED display devices and are complicated, which are not beneficial to an actual manufacturing process. Moreover, the designs are too complex for flexible display panels.

權(quán)利要求

1
What is claimed is:1. A display panel, comprising:a substrate;a luminescent layer disposed on the substrate; andan encapsulation layer disposed on the luminescent layer;wherein the encapsulation layer comprises a plurality of protrusions and a plurality of recesses, and the protrusions or the recesses are disposed on a side of the encapsulation layer away from the substrate;wherein the encapsulation layer comprises at least one inorganic layer and at least one organic layer, and the at least one inorganic layer and the at least one organic layer are alternately stacked;wherein the at least one inorganic layer is disposed on a side of the encapsulation layer adjacent to the luminescent layer, and the at least one inorganic layer is disposed on a side of the encapsulation layer away from the luminescent layer.2. The display panel of claim 1, wherein the protrusions or the recesses are disposed on the side of the encapsulation layer away from the substrate in an array arrangement.3. The display panel of claim 2, wherein a top of the protrusions has a curved surface.4. The display panel of claim 3, wherein a contact angle between the curved surface of the protrusions and a surface of the encapsulation layer ranges from 30° to 70°.5. The display panel of claim 2, wherein the protrusions are disposed in a luminescent display area corresponding to the encapsulation layer of the display panel.6. The display panel of claim 2, wherein a distance between adjacent protrusions ranges from 20 nm to 100 nm.7. The display panel of claim 1, wherein a height of each of the protrusions is same, or a depth of each of the recesses is same.8. The display panel of claim 7, wherein the height of each of the protrusions ranges from 20 nm to 1000 nm.9. The display panel of claim 1, wherein a material of the protrusions comprises one of an acrylic resin, a methacrylic resin, or an isoprene resin, or a material of the recesses comprises one of the acrylic resin, the methacrylic resin, or the isoprene resin.10. The display panel of claim 1, wherein the encapsulation layer comprises a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer; andthe first inorganic layer is disposed on the luminescent layer, the first organic layer is disposed on the first inorganic layer, the second inorganic layer is disposed on the first organic layer, the second organic layer is disposed on the second inorganic layer, and the third inorganic layer is disposed on the second organic layer.11. The display panel of claim 1, wherein a material of the at least one inorganic layer of the encapsulation layer comprises a metal oxide and a non-metal oxide.12. A method of manufacturing a display panel, comprising following steps:S100: providing a substrate, and forming a luminescent device layer of an organic light-emitting diode (OLED) on the substrate;S101: forming an encapsulation layer on the luminescent device layer, and orderly coating ink on the encapsulation layer;S102: irradiating the ink to cure the ink to form a plurality of protrusions; andS103: performing an encapsulation process to finish manufacturing the display panel.13. The method of claim 12, wherein in the S101, the ink is coated on the encapsulation layer by an inkjet printing method, and the ink comprises an organic resin material that is cured by ultraviolet light to form a polymer.14. The method of claim 12, wherein in the S101, the ink is coated on the encapsulation layer by an inkjet printing method to form the protrusions.15. The method of claim 12, wherein in the S101, an inorganic encapsulation layer and an organic encapsulation layer are sequentially formed on the luminescent device layer.16. The method of claim 15, wherein when the inorganic encapsulation layer and the organic encapsulation layer are sequentially formed on the luminescent device layer, the inorganic encapsulation layer is formed by a chemical vapor deposition method.17. The method of claim 15, wherein when the inorganic encapsulation layer and the organic encapsulation layer are sequentially formed on the luminescent device layer, the inorganic encapsulation layer is formed by a physical deposition method.18. The method of claim 15, wherein when the inorganic encapsulation layer and the organic encapsulation layer are sequentially formed on the luminescent device layer, the inorganic encapsulation layer is formed by an atomic layer deposition method.
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