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Circuit board and manufacturing method thereof

專利號(hào)
US11665833B2
公開日期
2023-05-30
申請(qǐng)人
QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD; Avary Holding (Shenzhen) Co., Limited.（CN Huai an CN Shenzhen）
發(fā)明人
Ming-Jaan Ho; Xian-Qin Hu; Fu-Yun Shen; Hsiao-Ting Hsu; Yong-Chao Wei
IPC分類
H05K1/02; H05K1/09; H05K3/04; H05K3/46; H05K1/11; H05K3/10
技術(shù)領(lǐng)域
circuit,hole,peelable,board,concave,conductive,groove,layer,conductor,in
地域： Huai an

摘要

A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

說明書

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A circuit board includes a substrate and two circuit layers. The substrate is provided with a conductive hole. The conductive hole is provided with a conductor. The substrate is provided with a groove on both sides, and each of the two circuit layers is respectively provided in the corresponding one of the two grooves. The groove includes a concave portion. The concave portion is located at the conductive hole, and the diameter of the concave portion is larger than the diameter of the conductive hole to expose a portion of the conductor. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, and the conductive hole electrically connects the two circuit layers. The manufacturing method of the circuit board of the present disclosure is relatively simple and the manufacturing cost is low. The circuit of the manufactured circuit board is formed in the groove, and the groove is formed by laser ablation. Therefore, the line width of the circuit layer is stable and the precision is high. The connection pad of the circuit board of the present disclosure is a conductive protrusion to improve the conductive yield.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a through hole formed in a substrate according to a first embodiment of the present disclosure.

FIG. 2 is a cross-sectional view of the through hole of the structure shown in FIG. 1 filled with a conductor.

FIG. 3 is a cross-sectional view of the structure shown in FIG. 2 covered with a peelable film.

權(quán)利要求

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