FIG. 3 is a perspective view of the body structure 26 of FIG. 2 with the antenna structures 48, 50, the amplifier 52, the ports 70, and the bias circuitry 72 of FIG. 2 omitted for illustrative purposes. The body structure 26 includes a surface 74 on which an amplifier will be mounted or otherwise arranged. As previously described, during operation, amplifiers generate heat within amplifier assemblies of spatial power-combining devices. In this manner, the surface 74 is arranged in closest proximity to a heat generating amplifier after assembly.

According to aspects disclosed herein, body structures of amplifier assemblies for spatial power-combining devices may include one or more heat sinks that are partially or fully embedded within the body structures. The heat sinks may be arranged in proximity to heat-generating amplifiers to provide effective heat dissipation paths away from such amplifiers. In certain embodiments, the heat sinks are formed with a higher thermal conductivity than a material that forms the body structures. In certain embodiments, the heat sinks may comprise single-phase heat sinks and/or two-phase heat sinks. In certain embodiments, heat sinks may comprise one or more of a solid metal, ceramic, graphite, or polymer materials and combinations thereof. For example, an exemplary amplifier assembly may comprise a copper or graphite heat sink that is embedded within an aluminum body structure. In certain embodiments, heat sinks may comprise pre-fabricated complex objects such heat pipes, thermal ground planes (TGP), and phase change materials such as paraffin wax.