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Micro light-emitting diode displays with improved power efficiency

專利號(hào)
US11665929B2
公開日期
2023-05-30
申請(qǐng)人
Intel Corporation(US CA Santa Clara)
發(fā)明人
Khaled Ahmed
IPC分類
H01L33/50; H01L27/15; H01L25/075; H01L27/32; H01L33/34
技術(shù)領(lǐng)域
micro,diode,emitting,light,pixel,layer,scattering,particles,in,mie
地域: CA CA Santa Clara

摘要

Micro light-emitting diode displays and methods of fabricating micro LED displays are described. In an example, a micro light emitting diode pixel structure includes a plurality of micro light emitting diode devices in a dielectric layer. Each of the micro light emitting diode devices have Mie scattering particles thereon. A transparent conducting oxide layer is above the dielectric layer and on the Mie scattering particles. A binder material layer is above the transparent conducting oxide layer. The binder material layer has a plurality of Rayleigh scattering particles therein.

說明書

One or more embodiments described herein are directed to devices and architectures for micro LED displays. To provide context, displays based on inorganic micro LEDs (μLEDs) have attracted increasing attention for applications in emerging portable electronics and wearable computers such as head-mounted displays and wristwatches. Micro LEDs are typically first manufactured on Sapphire or silicon wafers (for example) and then transferred onto a display backplane glass substrate where on which active matrix thin-film transistors have been manufactured.

Micro LED displays promise 3×-5× less power compared to organic LED (OLED) displays. The difference would result in a savings in battery life in mobile devices (e.g., notebook and converged mobility) and can enhance user experience. In an embodiment, micro LED displays described herein consume two-fold less power compared to organic LED (OLED) displays. Such a reduction in power consumption may provide approximately 8 hours of additional battery life. Such a platform may even outperform platforms based on low power consumption central processing units (CPUs). Embodiments described herein may be associated with one or more advantages such as, but not limited to, high manufacturing yield, high manufacturing throughput (display per hour), and applicability for displays with a diagonal dimension ranging from 2 inches to 15.6 inches.

In a first aspect of the present disclosure, structures for improved power efficiency micro LED displays are described.

權(quán)利要求

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