The first sealing member 510 and the second sealing member 520 may each independently include an inorganic material and may include, for example, a frit. The first sealing member 510 and the second sealing member 520 may be applied and formed by a dispenser and/or a screen printing method. A frit may sometimes refer to a powder-form glass raw material, however, in the present disclosure, the frit may also refer to a paste form in which a laser or infrared absorber, an organic binder, a filler for reducing a thermal expansion coefficient, and/or the like are included in a main material such as SiO₂. The paste-form frit may be cured by removing the organic binder and moisture through a drying or firing process. The laser or infrared absorber may include a transition metal compound. Laser light may be used as a heat source for curing the first sealing member 510 and the second sealing member 520 to bond the first substrate 110 and the second substrate 310 together.

Hereinafter, a display panel including an organic light-emitting diode as a display element will be described for convenience. However, embodiments of the present disclosure may also be applied to various suitable types (or kinds) of display panels such as inorganic EL display panels, quantum dot display panels, and/or liquid crystal display panels and display apparatuses including the same.

FIGS. 2A and 2B are equivalent circuit diagrams of pixels according to one or more embodiments of the present disclosure.