The invention claimed is:1. An electronic device, comprising:a package substrate;at least one integrated circuit (IC) die comprising a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate,at least one surface mount device (SMD) component including at least a first terminal and a second terminal on the package substrate positioned lateral to the IC die, andat least one SMD interconnect including a tie bar electrically connecting to at least one of the first terminal and the second terminal to the bond pads,wherein the tie bar extends to an outer edge of the electronic device,a mold compound for encapsulating at least the IC die, wherein the tie bar extends to be exposed from the outer edge of the mold compound.2. The electronic device of claim 1, wherein the package substrate comprises leadframe, a printed circuit (PCB) or a molded interconnect substrate (MIS).3. The electronic device of claim 1, wherein the at least one SMD interconnect electrically connects to at least one of the first terminal and the second terminal to the bond pads further comprising connects to the first terminal and the second terminal to the bond pads.4. The electronic device of claim 1, wherein at least one SMD interconnect includes a first interconnect having a first geometry and a second SMD interconnect having a second geometry that is different from the first geometry.5. The electronic device of claim 1, wherein the SMD compartment comprises an inductor, resistor, capacitor, transformer, or a diode.6. The electronic device of claim 5, wherein the SMD component comprises the inductor, and wherein the IC die comprises a power IC die.7. The electronic device of claim 1, further comprising an electrically conductive material between the SMD interconnect and the first terminal and the second terminal.8. The electronic device of claim 1, wherein the electronic device comprises a system in package (SIP).9. A method, comprising:providing a strip of package substrates including a mechanically interconnected plurality of surface mount device (SMD) interconnects joined by a tie bar that extends across through a saw street region between respective neighboring ones of the package substrates that mechanically connects to neighboring ones of the package substrates;mounting at least one integrated circuit (IC) die on each of the package substrates, the IC die comprising a substrate having a top side semiconductor surface including circuitry electrically coupled to bond pads that are electrically coupled to the SMD interconnects;molding to form a mold compound for encapsulating at least the IC die and the SMD interconnects;removing the mold compound in a first contact portion and a second contact portion of the first and the second SMD interconnect, respectively;mounting an SMD component having a first terminal and at least a second terminal with the first terminal mounted on the first contact portion and the second terminal mounted on the second contact portion, andsingulating the sheet of package substrates including cutting the SMD interconnects in the saw street region to provide a plurality of molded electronic devices, wherein a portion of the tie bar of the SMD interconnects extend to be exposed from an outer edge of the mold compound.10. The method of claim 9, wherein the package substrate comprises a leadframe, molded interconnect substrate (MIS), or a printed circuit board (PCB).11. The method of claim 9, wherein the at least one SMD interconnect electrically connects to at least one of the first terminal and the second terminal to the bond pads, further comprising connections to at least one of the first terminal and the second terminal to the bond pads.12. The method of claim 9, wherein the at least one SMD interconnect electrically connects to both of the first terminal and the second terminal to the bond pads further comprising connections to the first terminal and the second terminal to the bond pads.13. The method of claim 9, wherein the SMD component comprises an inductor, resistor, capacitor, transformer, or a diode.14. The method of claim 13, wherein the SMD component comprises the inductor, and wherein the IC die comprises a power IC die.15. The method of claim 9, further comprising an electrically conductive material between the SMD interconnect and the first terminal and the second terminal.16. The method of claim 9, wherein the electronic devices comprise a system in package (SIP).17. The method of claim 13, wherein the SMD component comprises a transformer.18. An electronic device, comprising:a package substrate;at least one integrated circuit (IC) die comprising a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate,at least one surface mount device (SMD) component including at least a first terminal and a second terminal on the package substrate positioned lateral to the IC die, andat least one SMD interconnect including a tie bar electrically connecting to the first terminal and the second terminal to the bond pads,a mold compound for encapsulating at least the IC die, wherein the tie bar extends to be exposed from an outer edge of the mold compound.19. The electronic device of claim 18, wherein the SMD component comprises a capacitor or an inductor.
