FIG. 2B depicts a portion of an example strip 250 of molded in-process electronic devices 290 each including the mechanically bridged SMD interconnects 100 shown in FIG. 1A with one mechanically bridged SMD interconnect 100 identified in this FIG., with each mechanically bridged SMD interconnect 100 being positioned over four adjacent molded electronic devices 290. The molded electronic devices 290 can implement an isolated DC-DC SIP power module including a transformer. Each molded electronic device 290 includes a first semiconductor die 120a and a second semiconductor die 120b that are shown flipchip mounted onto the package substrate 205. The SMD component here is a transformer. Because the SMD component is a transformer there are 4 independent SMD interconnects that will be provided after singulation for each of the electronic devices 290, shown as 210a, 210b, 210c, and 210d, instead of only 2, such as for the mounting of a inductor.

FIG. 3 shows an example in-process SIP 300 in a power module implementation after singulation including an SMD component shown as being an inductor comprising an inductor body 132, and an inductor terminations 138. The internal winding of the inductor is generally pre-molded within the inductor body 132 is typically applied by an inductor supplier, and received as shown with exposed inductor terminations 138 on both sides, for the final connection to the SMD interconnects 305 and 310.