FIG. 4B shows a top perspective view of an example SIP 400 reflecting a finished electronic device after singulation. The SIP 400 comprises the direct stack-up of the electronic device unit 240 shown in FIG. 2A including the package substrate 205 now shown as 420 including a semiconductor die (not visible in FIG. 4B) shown mounted thereon, a disclosed SMD interconnect 1151, and the SMD component shown again as an inductor comprising an inductor body 132, with one of the inductor terminations being shown as 138a.

FIG. 5 shows a bottom perspective view of the example SIP 400 shown in FIG. 4B. On a bottom side of the package substrate 420 there is shown exposed contact pads shown as 518, configured for mounting to a host device, such as a PCB. The outer edge surface 112a of the tie bar of an SMD interconnect is also shown exposed from the edge of the mold compound 291 shown in FIG. 4B on the surface of the package substrate 420.