Disclosed pluralities of mechanically bridged SMD interconnects allows for simultaneous mounting of what will be a plurality of SMD interconnects after singulation on a package substrate strip (or panel or sheet) having a plurality of units with each unit including a host device. The number of plurality of SMD interconnects for disclosed mechanically bridged SMD interconnects is at least two, and generally up to four for transformers utilizing standard TnR/surface mount (SMT) equipment, such that custom and often complex “gang attach” processes when utilizing gang clips are not required.

Disclosed mechanically bridged plurality of SMD interconnects are generally placed so that their center (the tie bar region) is on the saw street region center-line between in-process electronic device units on an electronic device strip comprising a package substrate comprising a leadframe, PCB or an MIS. Following singulation of the respective electronic devices from the strip, each mechanically bridged plurality of SMD interconnects becomes an individual (separated) SMD interconnect that are electrically and mechanically isolated from the other SMD interconnects that they were previously mechanically joined to.

Some of the plurality of mechanically bridged SMD interconnects can also optionally be placed on the package substrate fully inside the saw street region to thus remain mechanically and electrically joined within the electronic device, such as for a multi-phase transformer arrangement that may be included in a power module implementation. Electrical isolation of the respective SMD interconnects of the mechanically bridged plurality of SMD interconnects when having their center on the saw street center line is accomplished by sawing the saw streets which cuts the tie bars that connect together the plurality of mechanically bridged SMD interconnects.