FIG. 2B depicts a portion of an example strip of molded in-process electronic devices each including mechanically bridged SMD interconnects similar to those shown in FIG. 1A, but here with the mechanically bridged SMD interconnects containing four interconnects rather than two, being positioned over four adjacent molded electronic devices. The molded electronic devices can implement an isolated DC-DC SIP power module with a transformer. Each molded electronic device includes a first and a second semiconductor die that are shown flipchip mounted onto the package substrate. The SMD component for which this configuration is intended is a four terminal transformer.

FIG. 3 shows an example in-process SIP in a power module implementation after singulation including an SMD component shown as being an inductor comprising an inductor body and an inductor terminations.

FIG. 4A shows an example in-process SIP in a power module implementation including an SMD component shown again as being an inductor that has a first exposed termination shown connected to it on one side of the inductor body, and a second exposed termination connected to it on an opposite side of the inductor body.