FIG. 4B shows a top perspective view of an example SIP reflecting a finished electronic device after singulation. The SIP comprises the direct stack-up of the electronic device unit shown in FIG. 2A including the package substrate including a semiconductor die (not visible in FIG. 4B) shown mounted thereon, a disclosed SMD interconnect, and the SMD component shown again as being an inductor, with one of the inductor terminations shown.

FIG. 5 shows a bottom perspective view of the example SIP shown in FIG. 4B. On a bottom side of the package substrate, there is shown exposed contact pads configured for mounting to a host device, such as a PCB. The outer edge surface of the tie bar of an SMD interconnect is also shown exposed from the outer edge of the mold compound on the package substrate.

FIG. 6 shows a functional block diagram for an example isolated DC-DC converter package comprising a package substrate shown as a leadframe, showing a typical example of a capacitor placement along with a disclosed SMD interconnect shown collectively as 218/100 connected between VIN and PGND which comprises an input bypass capacitor arrangement. The isolated DC-DC converter package comprises a primary side including a first semiconductor die that includes a transformer driver and a secondary side including a second semiconductor die including a rectifier. There is a transformer stack including at least one coil is positioned between the first semiconductor die and the second semiconductor die.