FIG. 1B depicts for example, mechanically bridged SMD interconnect 150 showing a first SMD interconnect 105 and a second SMD interconnect 111 having a different geometry as compared to the first SMD interconnect 105, that are again shown mechanically connected together by first and second tie bars 112. An advantage of pairing the SMD interconnects is that the cantilever portions which corresponds to the raised ends of the SMD interconnects, can be extended (i.e., where the SMD interconnect meets the SMD component), allowing for more robust solderable (or electrically conductive epoxy or other suitable conductive material) connection to the SMD component's termination. The SMD component can comprise an inductor, resistor, capacitor, transformer, or a diode.

The mechanically bridged SMD interconnect 150 generally comprises copper. Although the mechanically bridged SMD interconnect 150 is shown having two SMD interconnects (first SMD interconnect 105, and second SMD interconnect 111), there can be mechanically joined three or more SMD interconnects including multiples of 2 such as 4, or even odd number of joined interconnects depending on the particular device layout.

FIG. 2A depicts a portion of an example strip 200 of molded in-process electronic devices 240 each including the mechanically bridged SMD interconnects 100 shown in FIG. 1A positioned between adjacent electronic device units 240. The mold compound is shown as 291. Each electronic device 240 includes a semiconductor die 120 which can be mounted flipchip, and in one arrangement can comprise a silicon-based power converter IC.