Each mechanically bridged SMD interconnect 100 with only one identified in FIG. 2A includes a first SMD interconnect 105 and a second SMD interconnect 110 that are mechanically connected together by tie bars 112 that are positioned (placed) so that the tie bars 112 are over the saw streets 215 shown including on the saw street's 215 center-line between molded in-process electronic device units 240 on the electronic device strip 200. As noted above, the package substrate 205 can comprise a PCB, leadframe, or an MIS.

Following molding in the typical case of a molded electronic device, the SMD interconnect is overmolded, and its top surface is then typically exposed (such as by using grinding, film assist molding, or laser ablation) to create a solderable contact area(s) for connecting the SMD component. There is generally then a solder deposition step or deposition of another electrically conductive material such as metal filled epoxy, or sintered silver deposition in the contact area of the SMD interconnect.

To create an electro-mechanical connection the SMD component is placed to make contact to the contact areas of the SMD interconnect and the electro-mechanical connection is established between the SMD interconnect and the SMD component. The SMD interconnect is electrically and mechanically connected to metal traces on the package substrate which as described above is generally molded, and finally the exposed device pads of the package substrate (generally on a bottom side) are generally connected to a host substrate, for example to a PCB.