The construction of the electrical enclosure 100 prevents external mechanical disturbances like shock and vibrations from loosening connections, damaging solder joints and wearing out components in the circuit board 120. In addition, the disclosed electrical enclosure 100 properly aligns the backplane connector 133 extending from housing 130 to its mating connector, thereby eliminating the possibility of bending the connector pins during insertion into mating connectors. Furthermore, due to the alignment facilitated by the structure of the electrical enclosure 100, automated assembly of the circuit board 120 within housing 130 is possible.

In addition, the electrical enclosure 100 disclosed herein is applicable to all electronic devices with die-cast, machine-processed enclosures as well as molded plastic, machined-processed, and 3D printed housings.

Embodiments are provided so as to thoroughly and fully convey the scope of the present disclosure to the person skilled in the art. Numerous details are set forth, relating to specific components, and methods, to provide a complete understanding of embodiments of the present disclosure. It will be apparent to the person skilled in the art that the details provided in the embodiments should not be construed to limit the scope of the present disclosure. In some embodiments, well-known processes, well-known apparatus structures, and well-known techniques are not described in detail.