When the chamber 210 of the electrical apparatus 200 is to be potted, because the same potting material is used for the same chamber, the same potting material will be used for the inductor 211 and the transformer 212 in the chamber 210, and the inductor 211 and the transformer 212 will be potted to reach the same height. For example, the same potting glue will be used for the inductor 211 and the transformer 212, and they will be potted to reach the same potting height.

However, on the one hand, the inductor 211 and the transformer 212 have different heat dissipation characteristics; a transformer, compared with an inductor, has a higher heat dissipation rate, which is, generating greater heat. When potting is to be performed, if the heat dissipation characteristic of the transformer needs to be met, then it is necessary to select a potting material which has a high heat dissipation rate; the potting material is high-cost, and the potting material having a high heat dissipation rate is unnecessary to the inductor 211. If the heat dissipation characteristic of the inductor 211 needs to be met, then it is necessary to select a potting material which has a low heat dissipation rate; however, in this case, heat generated by the transformer cannot be conducted in a timely manner, and use of the transformer is affected. Under such a circumstance, the heat dissipation needs of each electrical element cannot be met effectively, and there exists the problem of an increase in manufacture costs.