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Heat dissipation device for electronic component

專利號
US11744049B2
公開日期
2023-08-29
申請人
Valeo Siemens eAutomotive (Shenzhen) Co., Ltd.(CN Shenzhen)
發(fā)明人
Gongyuan Qu; Ronghui Li
IPC分類
H01L23/31; H05K7/20; H05K5/02
技術領域
potting,electrical,chamber,spacer,heat,in,element,sub,apparatus,second
地域: Shenzhen

摘要

Disclosed are an electrical apparatus, a method for manufacturing an electrical apparatus, and a motor vehicle, and the electrical apparatus. In the apparatus, a chamber includes a first electrical element located at a first position and a second electrical element located at a second position, the first electrical element and the second electrical element having different heat dissipation characteristics. The electrical apparatus further includes a potting spacer, the potting spacer separating the chamber into two sub-chambers: a first sub-chamber and a second sub-chamber. The first electrical element is located in the first sub-chamber, and the second electrical element is located in the second sub-chamber.

說明書

On the other hand, because potting is performed in the same chamber, the potting heights of each electrical element in the chamber are the same; in this case, if heat generated by each electrical element is to be conducted sufficiently, it is necessary to make the potting height of the potting material greater than or equal to the heat dissipation height of the electrical element which has the largest heat dissipation height in the chamber. This will cause a waste of potting materials and an increase in costs.

For example, if the inductor 211 and the transformer 212 are disposed in the chamber, the transformer has a high heat dissipation rate and a small heat dissipation height, and the inductor has a low heat dissipation rate and a large heat dissipation height, then, in the process of potting, on the one hand, in order to meet the heat dissipation need of the transformer, a potting material having high heat conductivity (which is high-cost) will be selected; on the other hand, in order to allow complete heat dissipation of the inductor, it is necessary to make the potting height of the potting material greater than or equal to the heat dissipation height of the inductor 211, which requires a large amount of potting. In this case, a potting material having high heat conductivity will be used to reach a relatively large heat dissipation height, which causes a waste of potting materials, an increase in manufacture costs, and an increase in the total weight of the electrical apparatus.

權利要求

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