Based on the preceding description, a potting spacer is used to separate a chamber in an electrical apparatus into a first sub-chamber and a second sub-chamber, and a first electrical element and a second electrical element that have different heat dissipation characteristics in the chamber are located, respectively, in the first sub-chamber and the second sub-chamber obtained after the separation. Thus, when the electrical apparatus is potted, based on respective heat dissipation characteristics possessed by the first electrical element and the second electrical element, different potting materials may be selected for the first sub-chamber and the second sub-chamber, and the first sub-chamber and the second sub-chamber may be potted, respectively, to reach different potting heights. Compared with a situation of potting in the same chamber, an electrical apparatus of the present application allows selection of potting materials based on heat dissipation characteristics of different electrical elements, effectively meeting heat dissipation needs of different electrical elements. In addition, when a plurality of electrical elements in the same chamber are potted, it prevents the problem of a waste of potting materials, which result from that the potting height is larger than heights actually needed by certain electrical elements, and further allows the electrical apparatus to have a relatively small total weight.

In certain embodiments, heat dissipation characteristics of the first electrical element 120 and the second electrical element 130 include a heat dissipation heights of the first electrical element 120 and of the second electrical element 130 and/or a heat dissipation parameters of the first electrical element 120 and of the second electrical element 130.