Printed circuit board and semiconductor module including the same
地域：
Suwon-si
摘要
A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.
說明書
This application claims priority under 35 USC § 119 to Korean Patent Application No, 10-2020-0153621, filed on Nov. 17, 2020 in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated by reference herein in its entirety.
Exemplary embodiments of the present inventive concept relate to a printed circuit board and a semiconductor module including the same. More particularly, exemplary embodiments of the present inventive concept relate to a printed circuit board configured to receive a passive element, and a semiconductor module including the printed circuit board.
Generally, a semiconductor module may include a printed circuit board (PCB), a pair of pads arranged on the PCB, and a passive element. Typically, the passive element may be mounted on the pads.
Further, the passive element on the pads may be typically bonded to the pads by a reflow process using a solder. Thus, an adhesive force between the passive element and the pads may be relatively weak.
權(quán)利要求
What is claimed is:1. A primed circuit board (PCB) comprising:an insulation substrate; a first pad arranged on the insulation substrate; a second pad arranged on the insulation substrate and spaced apart from the first pad along a first direction, wherein the second pad has a size substantially the same as a size of the first pad; a third pad arranged on the insulation substrate and spaced apart from the first pad along a second direction that is substantially perpendicular to the first direction; a fourth pad arranged on the insulation substrate and spaced apart from the third pad along the first direction, wherein the fourth pad is spaced apart from the second pad along the second direction, wherein the first pad includes a first recess having a rectangular shape configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate, wherein each of the first and second recesses has a first length along the first direction of about 0.29 times to about 0.86 times a first length of the first pad along the first direction, and wherein each of the first and second recesses has a second length along the second direction, which is substantially perpendicular to the first direction, of about 0.4 times to about 0.8 times a second length of the first pad along the second direction, wherein the first through fourth pads are arranged in the first and second directions by a substantially uniform gap. 2. The PCB of claim 1 , wherein the first recess is formed at a central portion of an inner surface of the first pad oriented toward the second pad, and the second recess is formed at a central portion of an inner surface of the second pad oriented toward the first pad. 3. The PCB of claim 2 , wherein the first length of the first pad is about 0.35 mm, the second length of the first pad is about 0.5 mm, and a distance between the first pad and the second pad is about 0.2 mm. 4. The PCB of claim 3 , wherein the first length of each of the first and second recesses is about 0.1 mm to about 0.3 mm, and the second length of each of the first and second recesses is about 0.2 mm to about 0.4 mm. 5. The PCB of claim 1 ,wherein the third pad has a size substantially the same as the size of the first pad, wherein the fourth pad has a size substantially the same as the size of the first pad, wherein the third pad includes a third recess having a shape substantially the same as the shape of the first recess and receiving a third electrode of the passive element, wherein the fourth pad includes a fourth recess having a shape substantially the same as the shape of the first pad and receiving a fourth electrode of the passive element, wherein the third recess has a depth substantially the same as a thickness of the third pad, wherein the fourth recess has a depth substantially the same as a thickness of the fourth pad, and wherein each of the third recess and the fourth recess exposes the upper surface of the insulation substrate. 6. The PCB of claim 5 , wherein the first to fourth recesses are respectively formed at adjacent corners of the first to fourth pads. 7. A printed circuit board (PCB) comprising:an insulation substrate; a first pad arranged on an upper surface of the insulation substrate; a second pad arranged on the upper surface of the insulation substrate and spaced apart from the first pad along a first direction; a third pad arranged on the insulation substrate and spaced apart from the first pad along a second direction that is substantially perpendicular to the first direction; and a fourth pad arranged on the insulation substrate and spaced apart from the third pad along the first direction, wherein the fourth pad is spaced apart from the second pad along the second direction, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess configured to receive a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, and wherein each of the first recess and the second recess exposes the upper surface of the insulation substrate, wherein the first through fourth pads are arranged in the first and second directions by a substantially uniform gap. 8. The PCB of claim 7 , wherein the first recess is formed at a central portion of an inner surface of the first pad oriented toward the second pad, and the second recess is formed at a central portion of an inner surface of the second pad oriented toward the first pad. 9. The PCB of claim 8 , wherein the first recess has a shape substantially the same as a shape of the second recess. 10. The PCB of claim 9 , wherein the first and second recesses have a rectangular shape. 11. The PCB of claim 7 , wherein the first pad has a shape substantially the same as a shape of the second pad. 12. The PCB of claim 7 ,wherein the third pad is arranged on the upper surface of the insulation substrate, wherein the fourth pad is arranged on the upper surface of the insulation substrate, wherein the third pad includes a third recess configured to receive a third electrode of the passive element, wherein the fourth pad includes a fourth recess configured to receive a fourth electrode of the passive element, wherein the third recess has a depth substantially the same as a thickness of the third pad, wherein the fourth recess has a depth substantially the same as a thickness of the fourth pad, and wherein each of the third recess and the fourth recess exposes the upper surface of the insulation substrate. 13. The PCB of claim 12 , wherein the first to fourth recesses are respectively formed at adjacent corners of the first to fourth pads. 14. The PCB of claim 13 , wherein the first to fourth recesses have substantially the same shape as one another. 15. The PCB of claim 13 , wherein the first to fourth pads have substantially the same shape as one another. 16. A semiconductor module comprising:a printed circuit board (PCB) including:an insulation substrate; a first pad arranged on an upper surface of the insulation substrate, wherein the first pad includes a first recess configured to expose the upper surface of the insulation substrate; and a second pad arranged on the upper surface of the insulation substrate and spaced apart from the first pad along a first direction, wherein the second pad includes a second recess configured to expose the upper surface of the insulation substrate; a passive element mounted on the first pad and the second pad, wherein the passive element is inserted into the first and second recesses; and a solder layer formed on the first and second pads to at least partially surround side surfaces of the passive element, wherein solder layer extends along the first recess and the second recess and does not extend into the first and second recesses. 17. The semiconductor module of claim 16 , wherein the passive element comprises a first electrode inserted into the first recess, and a second electrode inserted into the second recess. 18. The semiconductor module of claim 16 , wherein the PCB further comprises:a third pad arranged on the upper surface of the insulation substrate and spaced apart from the first pad along a second direction substantially perpendicular to the first direction, wherein the third pad includes a third recess configured to expose the upper surface of the insulation substrate; and a fourth pad arranged on the upper surface of the insulation substrate and spaced apart from the third pad along the first direction, wherein the fourth pad includes a fourth recess configured to expose the upper surface of the insulation substrate. 19. The semiconductor module of claim 18 , wherein the passive element comprises a first electrode inserted into the first recess, a second electrode inserted into the second recess, a third electrode inserted into the third recess, and a fourth electrode inserted into the fourth recess. 20. The semiconductor module of claim 16 , wherein the solder layer is coplanar with an inner side surface of the first pad and an inner side surface of the second pad.
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