白丝美女被狂躁免费视频网站,500av导航大全精品,yw.193.cnc爆乳尤物未满,97se亚洲综合色区,аⅴ天堂中文在线网官网

Printed circuit board and semiconductor module including the same

專利號
US11758652B2
公開日期
2023-09-12
申請人
SAMSUNG ELECTRONICS CO., LTD.(KR Suwon-si)
發(fā)明人
Dongyoon Seo; Geunje Park; Dohyung Kim; Hwanwook Park; Dongmin Jang; Jaeseok Jang
IPC分類
H05K1/11; H05K1/18
技術(shù)領(lǐng)域
pad,recess,passive,first,may,electrode,second,pcb,insulation,be
地域: Suwon-si

摘要

A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.

說明書

The second pad 130 may include a second recess 132. The second recess 132 may be formed at the inner corner of the second pad 130. The second recess 132 may be configured to receive the second electrode of the passive element. The second recess 132 may have a shape and a size substantially the same as the shape and the size of the second recess 132 in FIG. 1. Thus, the upper surface of the insulation substrate 110 may be exposed through the second recess 132.

The third pad 140 may include a third recess 142. The third recess 142 may be formed at the inner corner of the third pad 140. The third recess 142 may be configured to receive the third electrode of the passive element. The third recess 142 may have a shape and a size substantially the same as the shape and the size of the first recess 122 in FIG. 1. Thus, the upper surface of the insulation substrate 110 may be exposed through the third recess 142.

The fourth pad 150 may include a fourth recess 152. The fourth recess 152 may be formed at the inner corner of the fourth pad 150. The fourth recess 152 may be configured to receive the fourth electrode of the passive element. The fourth recess 152 may have a shape and a size substantially the same as the shape and the size of the second recess 132 in FIG. 1. Thus, the upper surface of the insulation substrate 110 may be exposed through the fourth recess 152.

權(quán)利要求

1
微信群二維碼
意見反饋