According to an exemplary embodiment of the present inventive concept, a printed circuit board (PCB) includes: an insulation substrate; a first pad arranged on the insulation substrate; and a second pad arranged on the insulation substrate and spaced apart from the first pad along a first direction, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess having a rectangular shape configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate, wherein each of the first and second recesses has a first length along the first direction of about 0.29 times to about 0.86 times a first length of the first pad along the first direction, and wherein each of the first and second recesses has a second length along a second direction, which is substantially perpendicular to the first direction, of about 0.4 times to about 0.8 times a second length of the first pad along the second direction.