The above and other features of the present inventive concept will become more apparent by describing in detail exemplary embodiments thereof, with reference to the accompanying drawings, in which:

FIG. 1 is a perspective view illustrating a printed circuit board (PCB) in accordance with an exemplary embodiment of the present inventive concept;

FIG. 2 is a cross-sectional view taken along a line A-A′ in FIG. 1;

FIGS. 3, 4 and 5 are a plan view and cross-sectional views illustrating a method of manufacturing the PCB in FIG. 1;

FIG. 6 is a perspective view illustrating a printed circuit board (PCB) in accordance with an exemplary embodiment of the present inventive concept;

FIG. 7 is a plan view illustrating a method of manufacturing the PCB in FIG. 6;

FIG. 8 is a perspective view illustrating a semiconductor module including the PCB in FIG. 1;

FIG. 9 is a cross-sectional view taken along a line B-B′ in FIG. 8;

FIG. 10 is a cross-sectional view taken along a line C-C′ in FIG. 9;