What is claimed is:1. An MRAM (magnetoresistive random-access memory) structure comprising:a spin-Hall-effect (SHE) rail;an spin-orbit-torque (SOT) magnetoresistive random access memory (MRAM) cell stack disposed above and in electrical contact with the SHE rail, wherein the SOT-MRAM cell stack comprises a free layer, a tunnel junction layer, a reference layer, and a diode structure;a write line disposed in electrical contact with the SHE rail; anda read line disposed above and adjacent to the diode structure.2. The MRAM structure according to claim 1, wherein the SHE rail is disposed in electrical contact with a transistor.3. The MRAM structure according to claim 1, wherein diode structure comprises a metal-oxide-metal layered structure.4. The MRAM structure according to claim 1, wherein the free layer is disposed adjacent to the SHE rail.5. The MRAM structure according to claim 1, wherein the write line is disposed above the SHE rail.6. The MRAM structure according to claim 1, wherein the write line is disposed below the SHE rail.7. The MRAM structure according to claim 1, wherein the SHE rail comprises a material selected from the group consisting of Ta, Pt, W, Jr, and combinations thereof.8. The MRAM structure according to claim 1, wherein the diode structure comprises a TiO2/Ti layer stack.9. An MRAM (magnetoresistive random-access memory) structure comprising:a spin-Hall-effect (SHE) rail disposed in electrical contact with a transistor;an spin-orbit-torque (SOT) magnetoresistive random access memory (MRAM) cell stack disposed above and in electrical contact with the SHE rail, wherein the SOT-MRAM cell stack comprises a free layer, a tunnel junction layer, a reference layer, and a diode structure;a write line disposed in electrical contact with the SHE rail; anda read line disposed above and adjacent to the diode structure.10. The MRAM structure according to claim 9, wherein diode structure comprises a metal-oxide-metal layered structure.11. The MRAM structure according to claim 9, wherein the free layer is disposed adjacent to the SHE rail.12. The MRAM structure according to claim 9, wherein the write line is disposed above the SHE rail.13. The MRAM structure according to claim 9, wherein the write line is disposed below the SHE rail.14. The MRAM structure according to claim 9, wherein the SHE rail comprises a material selected from the group consisting of Ta, Pt, W, Ir, and combinations thereof.15. The MRAM structure according to claim 9, wherein the diode structure comprises a TiO2/Ti layer stack.16. A method of fabricating a semiconductor device, the method comprising:forming a spin-Hall-effect (SHE) layer above and in electrical contact with a transistor;forming a spin-orbit-torque (SOT) magnetoresistive random access memory (MRAM) cell stack disposed above and in electrical contact with the SHE rail, wherein the SOT-MRAM cell stack comprises a free layer, a tunnel junction layer, a reference layer, and a diode structure;forming a write line disposed in electrical contact with the SHE rail;forming a protective dielectric layer covering a portion of the SOT-MRAM cell stack; andforming a read line disposed above and adjacent to the diode structure.17. The method of fabricating a semiconductor structure according to claim 16, wherein diode structure comprises a metal-oxide-metal layered structure.18. The method of fabricating a semiconductor structure according to claim 16, wherein the free layer is disposed adjacent to the SHE rail.19. The method of fabricating a semiconductor structure according to claim 16, wherein the write line is disposed above the SHE rail.20. The method of fabricating a semiconductor structure according to claim 16, wherein the write line is disposed below the SHE rail.