The technology described herein generally relates to devices, systems, and methods for transferring heat from a component within an electronic device to an external environment. More particularly, the various implementations disclosed herein generally relate to heat transfer assemblies configured to transfer heat from microprocessors, memory devices, and other components in electronic devices to an external environment.

Devices, including electronic devices such as set-top box assemblies, computers, smart phones, vehicle control systems, and others, commonly include one or more components that generate a heat (herein, a “heat source”). Such heat often needs to be transferred away from such heat source(s) in a device to facilitate operating conditions for the component within specified ranges. Such heat transfer may often occur by use of thermal conduction between the component and a heat plate or similar assembly (herein, a “heat plate”), where the heat plate is configured to further transfer the heat received from the component into an internal or external environment or to other components. Commonly, the heat plate uses thermal transfer mechanisms such as conduction, convection, radiation, evaporative cooling, active cooling, and other approaches known in the art for transferring heat.