For example, a heat plate 104 (“HP”) may be selected with thermal properties which facilitate a given heat transfer rate Q^?_HP and/or a given heat flux or thermal flux F_HP from a graphic sheet 108 (or a portion thereof) to one or more of an internal device environment, a top cover 102 of the device 132, and/or to an external device environment (for example, by radiation of heat using convection through one or more vents or slots in a top cover 102).

The heat plate 104 may be sized to accommodate the thermal properties and heat transfer properties specified for one or more heat sources 122 therein. The heat plate 104 may be configured to abut an enclosure, such as a top cover 102, or other member of a device 132, and to receive heat conducted from a heat source 122 in the device 132. The heat plate 104 may be configured to transfer the heat it receives from one or more heat sources 122 to an internal device environment, to an external device environment, and/or to other components 124 within a device 132.

It is to be appreciated that heat sources 122 and other components 124 within a device 132 may mechanically, thermally, and/or electrically interconnected by use of a printed circuit board (PCB) 120, wiring, or other known structures. Accordingly, the transfer of heat from any given component, such as a first heat source 122-1 is facilitated by an implementation. It is to be appreciated that the heat plate 104 may also be configured to transfer heat from one or more heat source 122 in a device 132 to one or more heat absorbing and/or other components 124 and/or environments within and/or external to a device 132.