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Heat transfer assembly

專(zhuān)利號(hào)
US11800687B2
公開(kāi)日期
2023-10-24
申請(qǐng)人
DISH Network L.L.C.（US CO Englewood）
發(fā)明人
SvitLana Trygubova; Steven Allen Nedved
IPC分類(lèi)
H05K7/20; H05K9/00
技術(shù)領(lǐng)域
heat,thermal,transfer,spring,graphite,pad,may,sheet,or,assembly
地域： CO CO Englewood

摘要

A heat transfer assembly includes a heat plate coupled to a spring and to a graphite sheet. The spring is at first location corresponding to a heat source in an assembled device. The graphite sheet extends over at least a middle portion of the spring and over portions of the heat plate. The graphite sheet is coupled to a thermal pad positioned above a given surface of the heat source. The spring provides a compressive force on the thermal pad when the device is in an assembled state. The compressive force enhances thermal conductivity between the heat source and the heat transfer assembly. The heat plate may be positioned within and thermally coupled to a cover of the device. Principally by use of the thermal pad, graphite sheet, and thermal plate, heat generated by the heat source is transferred to the cover and then to the external environment.

說(shuō)明書(shū)

An RF shield 400 may be soldered or other mechanically fastened to a PCB 120 or otherwise. Such soldering/fastening may result in a given second heat transfer rate Q?RFS-2 and/or a given second heat flux or thermal flux FRFS-2 transfer from a heat source 122, to the RF shield 400, to the PCB 120, and to one or more other components 124 on the PCB 120 or elsewhere within the device 132 and/or to a cover of the device 132. Accordingly, it is to be appreciated that known heat isolation components and/or techniques may be used to minimize, reduce, prevent or otherwise control transfer of heat from a heat source 122, via the RF shield 400, to the PCB 120 and elsewhere.

An RF shield 400 may be electrically grounded. An RF shield 400 may encompass a heat source 122 and/or other components of a device to operate as a Faraday cage, providing isolation of a given component of a device from RF signals and/or EMI.

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