An implementation of the present disclosure may use one or more of the above operations and other operations to provide a heat transfer assembly for use in a device to transfer heat from a heat source in the device. The use of such a heat transfer assembly may include the operations of positioning the heat transfer assembly in a first portion of the device, such as a top cover, such that a spring on the heat transfer assembly is aligned above a heat source in the device, wherein the component is position in a bottom cover. The operations may also include applying a downward force on the top cover while it is aligned with the bottom cover such that corresponding force is exerted by the spring onto the heat source via a graphic sheet and a thermal mat. The spring translates the downward force into a vertical deflection of the spring, which imparts a second downward force on the thermal mat such a specified thermal flux between the heat source and the thermal mat is attained. The second downward force is applied while the device is in an assembled state. The top cover is secured to the bottom cover during operation of the device and while the device is in the assembled state. The fastening of the top cover to the bottom cover may occur using any known methods and components.

The various implementations of the present disclosure also provide for an assembled electronic device wherein heat from a component in such device (i.e., a heat source) is transferred by a heat transfer assembly configured according to the above description.