Cooling device
地域：
Kariya
摘要
A cooling device includes: an electronic component; a circuit board on which the electronic component is mounted; and a heat sink provided to dissipate heat to an outside of the cooling device. The cooling device also includes: a graphite sheet integrally provided on a surface of the heat sink on one side facing the electronic component; a heat conductive portion contacting both a part of the graphite sheet and the electronic component; and a shielding portion. The shielding portion is provided at a position between a portion of the circuit board where no electronic component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet.
說明書
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The present application is based on and claims the benefit of priority of Japanese Patent Application No. 2020-095728, filed on Jun. 1, 2020, the disclosure of which is incorporated herein by reference.
The present disclosure generally relates to a cooling device.
A cooling device transfers heat from heat-generating components mounted on a circuit board to a graphite sheet for heat dissipation. The graphite sheet is provided to be sandwiched between a case and the heat-generating components. The graphite sheet faces the circuit board in a portion that is not in contact with the heat-generating components. The graphite sheet is brittle in strength and easily broken. Small pieces of the graphite sheet may fall on the circuit board, which may cause a problem.
It is an object of the present disclosure to provide a cooling device capable of suppressing adhesion of small pieces of graphite sheet to a circuit board.
Objects, features, and advantages of the present disclosure will become more apparent from the following detailed description made with reference to the accompanying drawings, in which:
權(quán)利要求
What is claimed is:1. A cooling device comprising:a heat-generating component; a circuit board on which the heat-generating component is mounted; an external heat dissipater provided to dissipate heat to outside of the cooling device; a graphite sheet containing graphene, which is integrally provided on a first surface of the external heat dissipater, the first surface being opposed to the heat-generating component; a heat conductive portion contacting both a part of the graphite sheet and the heat-generating component and having thermal conductivity capable of transferring heat from the heat-generating component to the graphite sheet; and a shielding portion provided at a position between a portion of the circuit board where no heat-generating component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet on a circuit board side thereof wherein the shielding portion includes an inner periphery portion located inside an outer periphery portion of the heat conductive portion and insertably in between the heat conductive portion and the graphite sheet. 2. The cooling device of claim 1 , whereinthe shielding portion includes an inner periphery portion formed to surround an outer periphery portion of the heat-generating component. 3. The cooling device of claim 2 , whereinthe inner periphery portion is formed as a part of a support portion that supports a lower surface of the heat conductive portion from below. 4. The cooling device of claim 1 , whereinthe shielding portion includes an inner periphery portion that is formed to surround the outer periphery portion of the heat conductive portion. 5. The cooling device of claim 4 , whereinthe inner periphery portion is in contact with the outer periphery portion, and covers a surface of a portion of the graphite sheet that is not in contact with the heat conductive portion. 6. The cooling device of claim 1 further comprising:a coated portion that covers at least a part of a circuit-board-side surface of the graphite sheet that is not in contact with the heat conductive portion, wherein the shielding portion is provided to cover an outer periphery portion of the coated portion. 7. The cooling device of claim 1 further comprising:a coated portion that covers at least a part of a circuit-board-side surface of the graphite sheet that is not in contact with the heat conductive portion, wherein the shielding portion is an annular protective portion that contacts at least a corner portion of an outer periphery portion of the coated portion. 8. The cooling device of claim 1 , further comprising:a coated portion that covers at least a part of a circuit-board-side surface of the graphite sheet that is not in contact with the heat conductive portion, wherein the shielding portion is an annular protective portion that contacts (i) an outer periphery portion of the coated portion and (ii) a circuit-board-side surface of the coated portion in a vicinity of the outer periphery portion. 9. The cooling device of claim 1 , further comprising:a coated portion that covers at least a part of a circuit-board-side surface of the graphite sheet that is not in contact with the heat conductive portion, wherein the shielding portion is a net-like portion provided to cover a circuit-board-side surface of the coated portion. 10. The cooling device of claim 1 , further comprising:a coated portion that covers at least a part of a circuit-board-side surface of the graphite sheet that is not in contact with the heat conductive portion, wherein the shielding portion is provided at a position between a portion of the circuit board where no heat-generating component is mounted and a circuit-board-side surface of the coated portion. 11. The cooling device of claim 1 , whereinthe shielding portion has a fixed portion fixed to the circuit board. 12. The cooling device of claim 1 , whereinthe shielding portion has a fixed portion fixed to the external heat dissipater. 13. The cooling device of claim 1 further comprising:a case for housing the circuit board, the heat-generating component, and the heat conductive portion, wherein the shielding portion is integrally provided in the case. 14. The cooling device of claim 1 , whereinthe shielding portion is a potting portion provided to fill a space between a circuit-board-side surface of the graphite sheet and an adjoining area of the heat conductive portion. 15. The cooling device of claim 1 , whereinthe shielding portion is a potting portion provided to cover a circuit-board-side surface of the graphite sheet and to fill space above the circuit board. 16. The cooling device of claim 1 , whereinthe heat-generating component, the heat conductive portion, the graphite sheet, and the external heat dissipater are stacked in this order and are in surface contact with each other. 17. The cooling device of claim 16 , whereinthe external heat dissipater includes a heat transfer portion and a fin, the heat transfer portion is flat plate-shaped and has the one side and an other side, which is opposite to the one side, the one side is in surface contact with the graphite sheet, and the fin protrudes from the other side of the heat transfer portion. 18. A cooling device comprising:a circuit board; an electric component mounted on top of the circuit board, wherein the electric component is configured to generate heat during use; a heat conductor contacting an upper surface of the electric component and extending horizontally beyond a perimeter of the upper surface of the electric component; a graphite sheet contacting an upper surface of the heat conductor and extending horizontally beyond a perimeter of the upper surface of the heat conductor; a heat sink including a heat transfer portion, wherein the heat transfer portion: (i) contacts an upper surface of the graphite sheet, (ii) extends horizontally beyond a perimeter of the upper surface of the graphite sheet, and (iii) extends a flange downward to surround an outer periphery portion of the graphite sheet; a shielding portion including: (i) a support portion, and (ii) a main part, wherein the shielding portion is configured to prevent particles from the graphite sheet from falling downward onto the circuit board, the shielding portion includes an inner periphery portion located inside an outer periphery portion of the heat conductor and insertably in between the heat conductor and the graphite sheet. 19. The cooling device of claim 18 ,wherein the support portion of the shielding portion extends under the outer peripheral portion of the heat conductor, and is configured to push the heat conductor upwardly against the graphite sheet. 20. The cooling device of claim 18 ,wherein the shielding portion further includes an outer periphery supporter extending upward from the main part and located between the outer periphery portion of the graphite sheet and an inner portion of the flange, and wherein the support portion extends above the outer periphery portion of the heat conductor, such that the outer periphery portion of the heat conductor upwardly presses the support portion against the graphite sheet. 21. The cooling device of claim 18 , whereinthe electric component, the heat conductor, the graphite sheet, and the heat sink are stacked in this order and are in surface contact with each other. 22. The cooling device of claim 21 , whereinthe heat transfer portion is flat plate-shaped and has one side and an other side, which is opposite to the one side, the one side is in surface contact with the graphite sheet, and the heat sink includes a fin that protrudes from the other side of the heat transfer portion.
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