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Cooling device

專利號
US11805593B2
公開日期
2023-10-31
申請人
DENSO CORPORATION(JP Kariya)
發(fā)明人
Yoshirou Baba
IPC分類
H05K1/02; H05K7/20
技術(shù)領(lǐng)域
portion,shielding,graphite,periphery,heat,sheet,board,conductive,circuit,outer
地域: Kariya

摘要

A cooling device includes: an electronic component; a circuit board on which the electronic component is mounted; and a heat sink provided to dissipate heat to an outside of the cooling device. The cooling device also includes: a graphite sheet integrally provided on a surface of the heat sink on one side facing the electronic component; a heat conductive portion contacting both a part of the graphite sheet and the electronic component; and a shielding portion. The shielding portion is provided at a position between a portion of the circuit board where no electronic component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet.

說明書

The contacting part 262 is an edge portion on an inner periphery portion 262a side of the main part 61. The contacting part 262 is an annular portion that surrounds the opening of the shielding portion 206. By having the contacting part 262, a gap between the heat conductive portion 5 and the shielding portion 206 is closed. By having such shielding portion 206, the small pieces of the graphite sheet 4 can be received by the shielding portion 206 without letting them to adhering to the circuit board. Further, according to the shielding portion 206, since the heat conductive portion 5 comes into contact with the outer periphery portion 51, the heat conductive portion 5 can be reduced in size.

Fourth Embodiment

The fourth embodiment is described with reference to FIG. 10. The fourth embodiment is different from the above-described embodiments in the configuration related to a shielding portion 306 and the configuration including a coated portion 42. The configurations, operations, and effects not particularly described in the fourth embodiment are the same as those in the above-described embodiments, and the differences from the above-described embodiments are described in the following.

權(quán)利要求

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