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Cooling device

專利號
US11805593B2
公開日期
2023-10-31
申請人
DENSO CORPORATION(JP Kariya)
發(fā)明人
Yoshirou Baba
IPC分類
H05K1/02; H05K7/20
技術(shù)領(lǐng)域
portion,shielding,graphite,periphery,heat,sheet,board,conductive,circuit,outer
地域: Kariya

摘要

A cooling device includes: an electronic component; a circuit board on which the electronic component is mounted; and a heat sink provided to dissipate heat to an outside of the cooling device. The cooling device also includes: a graphite sheet integrally provided on a surface of the heat sink on one side facing the electronic component; a heat conductive portion contacting both a part of the graphite sheet and the electronic component; and a shielding portion. The shielding portion is provided at a position between a portion of the circuit board where no electronic component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet.

說明書

The shielding portion 306 includes the main part 61 that faces the coated portion 42 and is separated from the coated portion 42, and a support portion 362. The main part 61 and the leg part 63 are separate members that are joined together, or have a configuration that is integrally formed by two-color molding. The main part 61 has a flat plate shape having an inner periphery portion 362a forming an opening. The shielding portion 306 is fixed to the circuit board 8 at a plurality of positions. The support portion 362 comes into contact with the lower surface of the coated portion 42 and supports the integral body of the coated portion 42 and the graphite sheet 4 from below. The inner periphery portion 362a is formed as a part of the support portion 362. The inner periphery portion 362a is formed so as to surround the outer periphery portion 51 of the heat conductive portion 5. The inner periphery portion 362a is located outside the outer periphery portion 51 of the heat conductive portion 5. Alternatively, the inner periphery portion 362a may be configured to be in contact with the outer periphery portion 51 of the heat conductive portion 5.

The shielding portion 306 of the fourth embodiment is provided at a position between a portion of the circuit board where no heat-generating component is mounted and the circuit-board-side surface of the coated portion 42. According to such configuration, even if the graphite sheet 4 in a portion reinforced by the coated portion 42 is chipped, the small pieces can be received by the shielding portion 306.

Fifth Embodiment

權(quán)利要求

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