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Cooling device

專利號(hào)
US11805593B2
公開日期
2023-10-31
申請(qǐng)人
DENSO CORPORATION(JP Kariya)
發(fā)明人
Yoshirou Baba
IPC分類
H05K1/02; H05K7/20
技術(shù)領(lǐng)域
portion,shielding,graphite,periphery,heat,sheet,board,conductive,circuit,outer
地域: Kariya

摘要

A cooling device includes: an electronic component; a circuit board on which the electronic component is mounted; and a heat sink provided to dissipate heat to an outside of the cooling device. The cooling device also includes: a graphite sheet integrally provided on a surface of the heat sink on one side facing the electronic component; a heat conductive portion contacting both a part of the graphite sheet and the electronic component; and a shielding portion. The shielding portion is provided at a position between a portion of the circuit board where no electronic component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet.

說明書

The fifth embodiment is described with reference to FIG. 11. The fifth embodiment differs from the fourth embodiment in the configuration relating to a shielding portion 406. The configurations, operations, and effects not particularly described in the fifth embodiment are the same as those in the above-described embodiment(s), and the differences from the above-described embodiment(s) are described below.

As shown in FIG. 11, the shielding portion 406 is a member separate from the leg part 63. The shielding portion 406 includes a fixed portion 463 fixed to the circuit board 8. The fixed portion 463 is a wall-shaped portion extending downward from the main part 61. The fixed portion 463 has, formed thereon, a welded portion whose end portion is welded to the circuit board 8 and fixed, for example.

Sixth Embodiment

The sixth embodiment is described with reference to FIGS. 12 to 18. In the cooling device of the sixth embodiment, a shielding portion 506 and an upper case member 131 are different from those of the first embodiment. The configurations, operations, and effects not particularly described in the sixth embodiment are the same as those in the first embodiment, and the differences from the first embodiment are described below.

權(quán)利要求

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