Further, in the present example, the smoothing capacitor C2 is connected to the upper and lower arm circuit 10 in parallel, and smooths the voltage of the electric power line. According to this, the voltage fluctuation of the electric power line can be suppressed. Since the electric charges can be instantaneously supplied from the smoothing capacitor C2 to the capacitor C1, the capacitance of the capacitor C1 can be reduced. As such, it is possible to reduce the size of the capacitor C1.
The example in which the two semiconductor devices 20 each having the 1-in-1 package structure are used as the semiconductor devices 20 has been described. However, the present embodiment is not limited to the example described. A semiconductor device having a 2-in-1 package structure in which elements for the two arms (upper arm 10U and lower arm 10L) forming the upper and lower arm circuit 10 are packaged in a unit can be used.
The arrangement of the main terminals 70 is not limited to the example described above. In the case of the 1-in-1 package, the semiconductor device 20 may have at least one main terminal 70C and at least one main terminal 70E. The main terminal 70 having the same potential may be divided into multiple terminals. For example, the main terminal 70C may be divided into multiple terminals. By parallelizing the multiple terminals, it is possible to reduce the entire inductance of the divided terminals. In the case of the 2-in-1 package, it is sufficient to have at least one main terminal 70C of the upper arm 10U, and at least one main terminal 70E of the lower arm 10L, and at least one output terminal.