According to the present embodiment, the portion of the housing flow path 711 facing the power module 110 is located upstream of the portion of the housing flow path 711 facing the smoothing capacitor C2. In this configuration, the refrigerant cooled by the cooling circuit flows into the housing flow path 711 through the inflow hole 715 and then approaches the power module 110 before the smoothing capacitor C2. In this case, since the power module 110 is cooled by the refrigerant before the refrigerant receiving heat from the smoothing capacitor C2 in the housing flow path 711, the cooling effect of the power module 110 by the refrigerant can be enhanced.
According to the present embodiment, the inflow region 741 and the outflow region 742 are connected through the flow paths 126 of the respective power modules 110. Therefore, it is possible to realize a configuration in which the refrigerant easily flows from the housing flow path 711 into the flow paths 126 of the power modules 110.