The power module 110 also includes the cooling unit 120. The flow path 126 of the cooling unit 120 is in communication with the housing flow path 711 so that the refrigerant flows from the housing flow path 711 into the flow path 126 of the cooling unit 120 and flows again into the housing flow path 711 from the flow path 126 of the cooling unit 120. In this way, the refrigerant can be introduced from the housing 703 into the cooling unit 120 inside of the power module 110, and thus the semiconductor device 20 can be cooled inside of the power module 110. The semiconductor device 20 is arranged on the surface of the cooling unit 120. Therefore, the semiconductor device 20 can be effectively cooled. Further, in the cooling unit 120, the capacitor C1 is arranged on the opposite side of the semiconductor device 20. Therefore, the capacitor C1 can also be effectively cooled. The capacitor C1 corresponds to a module capacitor.
In the housing 703, the housing flow path 711 is separated into the upstream region 234a and the downstream region 234b. The flow path 126 of the power module 110 connects the upstream region 741 and the downstream region 742. In such a configuration, the refrigerant easily flows into the flow path 126 of the cooling unit 120. Therefore, the semiconductor device 20 and the capacitor C1 can be cooled more effectively.