The example in which the semiconductor device 20 is arranged adjacent to the outer cooling part 713 in the power module 110 has been described. However, the present embodiment is not limited to such a configuration. The capacitor C1 may be arranged adjacent to the outer cooling part 713. However, it is preferable to cool the semiconductor device 20 having a large temperature change per unit time on the side adjacent to the outer cooling part 713.
The present embodiment can refer to the preceding embodiment. Therefore, the descriptions of the parts common to the drive system 1, the electric power conversion device 5, the semiconductor device 20, the power module 110, and the motor unit 800 shown in the preceding embodiment will be omitted.