As shown in FIG. 3, FIG. 5, and FIG. 7, the conductive member 50C has a main portion 51C that is a thick portion in the Z direction and an extension portion 52C that is a portion thinner than the main portion 51C. The main portion 51C has a substantially planar shape with a substantially constant thickness. The main portion 51C has a mounting surface 53C adjacent to the semiconductor chip 40 in the Z direction and a heat radiation surface 54C opposite to the mounting surface 53C in the Z direction. The extension portion 52C extends from the end of the main portion 51C in the Y direction. The extension portion 52C extends in the Y direction with the same length in the X direction, that is, the same width as the main portion 51C. A surface of the extension portion 52C adjacent to the semiconductor chip 40 is substantially flush with the mounting surface 53C of the main portion 51C. An opposite surface of the extension portion 52C further from the semiconductor chip 40 is sealed by the sealing resin body 30. The extension portion 52C may be provided at, at least, an end of the conductive member 50C, at which the main terminals 70 are provided. In the present example, the conductive member 50C has the extension portions 52C at both ends of the main portion 51C. In FIG. 7, a boundary between the main portion 51C and the extension portion 52C is shown by a long dashed double-dotted line.
